Qualcomm
2,286 known vulnerabilities
Top Products
Memory corruption when processing camera sensor input/output control codes with invalid output buffers.
Memory corruption when dynamically changing the size of a previously allocated buffer while its contents are being modif
Transient DOS when processing a malformed Fast Transition response frame with an invalid header structure during wireles
Transient DOS when processing target power rate tables during channel configuration.
Memory Corruption when handling power management requests with improperly sized input/output buffers.
Transient DOS when receiving a service data frame with excessive length during device matching over a neighborhood aware
Memory Corruption when using deprecated DMABUF IOCTL calls to manage video memory.
Memory Corruption when accessing an output buffer without validating its size during IOCTL processing in a camera sensor
Memory Corruption when accessing an output buffer without validating its size during IOCTL processing in a camera sensor
Memory Corruption when accessing an output buffer without validating its size during IOCTL processing.
Memory Corruption when processing auxiliary sensor input/output control commands with insufficient buffer size validatio
Memory Corruption when accessing an output buffer without validating its size during IOCTL processing.
Memory Corruption when sending IOCTL requests with invalid buffer sizes during memcpy operations.
Memory Corruption when retrieving output buffer with insufficient size validation.
Transient DOS when processing nonstandard FILS Discovery Frames with out-of-range action sizes during initial scans.
Cryptographic issue while copying data to a destination buffer without validating its size.
Memory corruption when decoding corrupted satellite data files with invalid signature offsets.
Memory corruption while processing a frame request from user.
Memory corruption while preprocessing IOCTL request in JPEG driver.
Memory corruption when buffer copy operation fails due to integer overflow during attestation report generation.
Memory Corruption when accessing freed memory due to concurrent fence deregistration and signal handling.
Memory corruption while using alignments for memory allocation.
Memory Corruption when processing invalid user address with nonstandard buffer address.
Memory Corruption when adding user-supplied data without checking available buffer space.
Memory Corruption while invoking IOCTL calls when concurrent access to shared buffer occurs.
Memory Corruption when accessing trusted execution environment without proper privilege check.
Transient DOS when MAC configures config id greater than supported maximum value.
Weak configuration may lead to cryptographic issue when a VoWiFi call is triggered from UE.
Memory Corruption while processing IOCTL calls when concurrent access to shared buffer occurs.
Memory Corruption when concurrent access to shared buffer occurs due to improper synchronization between assignment and
Cryptographic Issue when a shared VM reference allows HLOS to boot loader and access cert chain.
Memory Corruption when accessing a buffer after it has been freed while processing IOCTL calls.
Memory Corruption when concurrent access to shared buffer occurs during IOCTL calls.
Memory corruption while handling different IOCTL calls from the user-space simultaneously.
Memory Corruption when accessing buffers with invalid length during TA invocation.
Transient DOS when an LTE RLC packet with invalid TB is received by UE.
Transient DOS when processing a received frame with an excessively large authentication information element.
Memory Corruption while processing IOCTL call to update sensor property settings with invalid input parameters.
Memory Corruption while deallocating graphics processing unit memory buffers due to improper handling of memory pointers
Memory Corruption when initiating GPU memory mapping using scatter-gather lists due to unchecked IOMMU mapping errors.
Cryptographic issue when a Trusted Zone with outdated code is triggered by a HLOS providing incorrect input.
Memory corruption while calculating offset from partition start point.
Memory corruption when calculating oversized partition sizes without proper checks.
Memory Corruption when multiple threads simultaneously access a memory free API.
Memory Corruption when user space address is modified and passed to mem_free API, causing kernel memory to be freed inad
Memory corruption occurs when a secure application is launched on a device with insufficient memory.
Transient DOS while parsing a WLAN management frame with a Vendor Specific Information Element.
Memory corruption when copying overlapping buffers during memory operations due to incorrect offset calculations.
Memory corruption when accessing resources in kernel driver.
Memory corruption while passing pages to DSP with an unaligned starting address.
Frequently Asked Questions
How many CVEs affect Qualcomm?
Qualcomm has 2,286 CVE records in our database, including 22 critical and 1506 high severity vulnerabilities. 1 of these are listed in CISA's Known Exploited Vulnerabilities catalog.
What are the most severe Qualcomm vulnerabilities?
Qualcomm has 22 critical severity (CVSS 9.0+) and 1506 high severity (CVSS 7.0-8.9) vulnerabilities. 1 vulnerabilities are confirmed as actively exploited in the wild.
How can I scan for Qualcomm vulnerabilities?
CyberStrike's AI-powered security agents automatically detect vulnerabilities in Qualcomm products across your infrastructure. The platform provides continuous pentesting, DAST scanning, and real-time vulnerability monitoring with actionable remediation guidance.
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